JVCC EGPF-02 Kapton Polyimide Film Tape: 1 in x 36 yds. (Amber / Transparent)

<p><b>JVCC EGPF-02 Kapton™ Polyimide Film Tape</b> is a 2 mil electrical grade Kapton alternative POLYIMIDE film coated with a high performance silicone adhesive. It is a wave solder/hot air leveling tape used to protect gold contacts on printed circuit boards from molten solder during hot air wave solder leveling process. It is thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures (good for high-temperature masking applications). Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of board during processing. <b>EGPF-02 Kapton Electrical Grade/Printed Circuit Polyimide Film Tape</b> has excellent resistance to acids, oils, solvents, aging, staining and water immersion.</p> NOTES: Sizes shipped will typically be the tape industry standard metric-cut sizes, i.e. 24mm for each 1 inch of nominal tape width ordered (rolls are approximately 5% narrower than the nominal size). This product's actual size is 25.4mm wide. This tape is typically cut to width from log rolls so most sizes ship on non-branded plain white cores. As with any adhesive tape product it is always the user's responsibility to determine that the product is suitable for their intended use; e.g. if you want to remove a product cleanly from a specific type of substrate please test on an inconspicuous area first.<br><br><b>Technical Information</b><br>- Core: 3 inch diameter plastic <br>- Backing/Carrier: electrical grade polyimide film <br>- Adhesive: high-performance silicone <br>- Standards Met: MIL-P-46112B; UL510 approved for flame retardance <br>- Thickness: 3.6 mils (carrier, adhesive) 2 mils (carrier) <br>- Adhesion: 21 ounces per inch (to stainless steel test panel) <br>- Tensile Strength: 21 pounds per inch (longitudinal) <br>- Dielectric Strength: 7000 volts <br>- Service/Operating Temperature: up to 392F <br>- Elongation: 70 % <br>

• JVCC EGPF-02 Kapton Polyimide Film Tape is a 2 mil electrical grade Kapton alternative POLYIMIDE film coated with a high-performance silicone adhesive.
• It is a wave solder/hot air leveling tape used to protect gold contacts on printed circuit boards from molten solder during hot air wave solder leveling process. It is thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures (good for high-temperature masking applications).
• Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of board during processing.
• EGPF-02 Kapton Electrical Grade/Printed Circuit Polyimide Film Tape has excellent resistance to acids, oils, solvents, aging, staining, and water immersion.
• Carrier/Backing: electrical grade polyimide film. Adhesive: high-performance silicone. Thickness: 3.6 mils (carrier, adhesive) 2 mils (carrier). Adhesion: 21 ounces per inch (to stainless steel test panel). Tensile Strength: 21 pounds per inch (longitudinal). Dielectric Breakdown: 7000 volts. Service/Operating Temperature: up to 392F. Elongation: 70%. Standards Met: MIL-P-46112B; UL510 approved for flame retardance. Core: 3-inch diameter plastic.